Precision CNC Machining Parts for Aluminum Pin Fin Heat Sink with Multiple Surface Finishing and Tight Tolerance Control | ChenRong
Product Summary
Custom CNC Milled 6061 Aluminum Pin Fin Heat Sink for Semiconductor And Power Electronic Equipment Quick detail Solid‑block milled pin fin heat sink uses dense cylindrical pin array for enlarged heat exchange area. Reverse‑side pockets and threaded mounting bosses enable direct module fitting. ...
Product Custom Attributes
Basic Properties
Trading Properties
Product Description
Custom CNC Milled 6061 Aluminum Pin Fin Heat Sink for Semiconductor And Power Electronic Equipment
Quick detail
Solid‑block milled pin fin heat sink uses dense cylindrical pin array for enlarged heat exchange area. Reverse‑side pockets and threaded mounting bosses enable direct module fitting. Multiple surface finishing selections are available. Strict in‑house inspection validates flatness and dimension for every production batch.
Product description
This pin‑fin cooling component is milled from monolithic aluminum billet instead of assembled parts. Integrated pin‑fin construction removes assembly gaps and effectively lowers thermal resistance. Custom pockets and mounting bosses are machined on reverse side to fit customer‑specific housing structures. Internal inspection procedures carry out flatness testing and dimension sampling prior to shipment. Pin height , pin density and surface finish can be adjusted according to thermal requirements from submitted drawings.
Custom parameter table
| Parameter | Value |
|---|---|
| Processing Type | CNC Milling , Deburring , Edge Polishing |
| Available Material | Aluminum 6061 , 6063 , 7075 |
| Tolerance | ±0.03 mm |
| Surface Finish | As‑machined , Sandblasting , Clear / Black Anodizing |
| Drawing Format | 2D PDF / CAD , 3D STEP / IGES |
| Application Scenario | Semiconductor Test Device , High‑power Converter |
| Inspection Method | Height Gauge , CMM Sampling Check |
| Production Range | Prototype , Small Batch , Mass Production |
Product features
- One‑piece solid billet milling without assembly gaps
- Dense cylindrical pin array maximizes heat exchange area
- Reverse‑side customized pockets and threaded mounting bosses
- Tightly controlled base flatness for reliable heat‑source contact
- Adjustable pin geometry matched to thermal design requirements
Product application
Semiconductor Test Device
Pin‑fin structure dissipates continuous operating heat for high‑power test modules and stabilizes instrument running status.
High‑power Converter
Works as thermal control component for power conversion hardware. Solid aluminum base keeps low thermal resistance under long‑duration load.
FAQ
Q1: Can pin height and pin spacing be adjusted?
A1: Yes. Pin diameter , height and array layout can be adjusted according to your thermal simulation data.
Q2: Which surface option improves radiative heat dissipation?
A2: Black anodizing can enhance radiative heat dissipation upon request. Clear anodizing is widely used for anti‑corrosion purpose.
Q3: Do you accept short‑lead prototype orders?
A3: Prototype sampling is supported. Submit drawing files for lead‑time evaluation.
Q4: What maximum dimension can be processed?
A4: Maximum processing length reaches 800 mm. Submit drawings for detailed manufacturability review.
Q5: Will you provide DFM suggestions before production?
A5: DFM feedback including manufacturability risk points will be delivered after drawing review.
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MFor a shop that goes through a few of these a quarter, the savings add up. Reordering now.
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HThey proactively and responsibly discuss and resolve any issues that arise during production; they are highly responsible and a trustworthy manufacturer.
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JThese tools work great.
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