Precision CNC Machining Parts for Aluminum Pin Fin Heat Sink with Multiple Surface Finishing and Tight Tolerance Control | ChenRong
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,pin fin heat sink tight tolerance
,aluminum CNC parts surface finishing
Custom CNC Milled 6061 Aluminum Pin Fin Heat Sink for Semiconductor And Power Electronic Equipment
Quick detail
Solid‑block milled pin fin heat sink uses dense cylindrical pin array for enlarged heat exchange area. Reverse‑side pockets and threaded mounting bosses enable direct module fitting. Multiple surface finishing selections are available. Strict in‑house inspection validates flatness and dimension for every production batch.
Product description
This pin‑fin cooling component is milled from monolithic aluminum billet instead of assembled parts. Integrated pin‑fin construction removes assembly gaps and effectively lowers thermal resistance. Custom pockets and mounting bosses are machined on reverse side to fit customer‑specific housing structures. Internal inspection procedures carry out flatness testing and dimension sampling prior to shipment. Pin height , pin density and surface finish can be adjusted according to thermal requirements from submitted drawings.
Custom parameter table
| Parameter | Value |
|---|---|
| Processing Type | CNC Milling , Deburring , Edge Polishing |
| Available Material | Aluminum 6061 , 6063 , 7075 |
| Tolerance | ±0.03 mm |
| Surface Finish | As‑machined , Sandblasting , Clear / Black Anodizing |
| Drawing Format | 2D PDF / CAD , 3D STEP / IGES |
| Application Scenario | Semiconductor Test Device , High‑power Converter |
| Inspection Method | Height Gauge , CMM Sampling Check |
| Production Range | Prototype , Small Batch , Mass Production |
Product features
- One‑piece solid billet milling without assembly gaps
- Dense cylindrical pin array maximizes heat exchange area
- Reverse‑side customized pockets and threaded mounting bosses
- Tightly controlled base flatness for reliable heat‑source contact
- Adjustable pin geometry matched to thermal design requirements
Product application
Semiconductor Test Device
Pin‑fin structure dissipates continuous operating heat for high‑power test modules and stabilizes instrument running status.
High‑power Converter
Works as thermal control component for power conversion hardware. Solid aluminum base keeps low thermal resistance under long‑duration load.
FAQ
Q1: Can pin height and pin spacing be adjusted?
A1: Yes. Pin diameter , height and array layout can be adjusted according to your thermal simulation data.
Q2: Which surface option improves radiative heat dissipation?
A2: Black anodizing can enhance radiative heat dissipation upon request. Clear anodizing is widely used for anti‑corrosion purpose.
Q3: Do you accept short‑lead prototype orders?
A3: Prototype sampling is supported. Submit drawing files for lead‑time evaluation.
Q4: What maximum dimension can be processed?
A4: Maximum processing length reaches 800 mm. Submit drawings for detailed manufacturability review.
Q5: Will you provide DFM suggestions before production?
A5: DFM feedback including manufacturability risk points will be delivered after drawing review.
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JOrdered a batch of custom alloy housing cavities for embedded control hardware. The CMM inspection data is traceable for each lot. The flatness and position tolerance of mounting holes are well controlled. Parts fit seamlessly on our PCB assemblies. Fast response and flexible MOQ for custom instrument parts.
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MWe ordered custom CNC aluminum enclosure cavities for our industrial control instruments. The dimensional tolerance is well controlled, the cavity interior has no burrs, and the anodizing finish is uniform. All housings fit our PCB assembly perfectly.
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KWe were looking for a reliable supplier for small-batch metal CNC machined prototypes. ChenRong handled our 80-piece aluminum parts order smoothly. The DFM feedback was helpful before production, tolerances are well controlled, and they accommodated our minor design revision. The shipment arrived safely with full inspection documents.
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